The Significance of In-Circuit Testing (ICT) for Printed Circuit Board Assembly (PCBA) Testing

Printed Circuit Board Assembly (PCBA) testing is crucial for ensuring the proper functioning of electronic devices. With hundreds of components and thousands of solder connections, PCBA can be a complex assembly. To ensure the quality and functionality of each component, individual testing of the board is necessary.

In-Circuit Testing (ICT) is a popular PCBA board testing method that helps detect defective components. This fully automated test allows technicians to replace or fix any faulty parts before proceeding to the next procedure. ICT checks for shorts, opens, resistance, capacitance, and other basic quantities which will flag any discrepancies. It is an easy-to-program method that can detect various manufacturing defects, including component spacing, lead spacing, land sizes, component markings, soldering and process issues, and more.

However, there are also disadvantages to using ICT. Test fixtures can be expensive, and ICT may fail to identify connector faults in high-density, small package size SMT components. Additionally, inconsistent results can occur if test pins do not make proper contact with the appropriate test pads, and the test pins need to be regularly cleaned and replaced to prevent failure.

Despite its flaws, ICT is still considered one of the best ways to test many PCBAs today. Its advantages in easily detecting manufacturing defects, ability to program and interpret test results, and its capacity for rapid response to dynamic product test requirements make it a reliable and widely used method.

If you need help with your next PCBA project and require expertise in ICT or other testing methods, CEN has a knowledgeable team that can provide advice and support.