At CEN PCBA, we pride ourselves on delivering the highest quality and reliability in our PCB manufacturing process. To achieve this, we employ a range of advanced inspection methods that ensure every PCB meets the most stringent industry standards. Here’s how we do it:
Visual Inspection: Our skilled technicians visually examine every PCB for soldering and assembly quality, ensuring the integrity of solder joints and correct component installation.
X-ray Inspection: We utilize state-of-the-art X-ray scanners to inspect internal solder connections and component placements, especially useful for detecting hidden joints in complex PCB layouts.
Silicone Sampling: This method involves adding a layer of special silicone on the PCB, peeling it off, and observing the imprints to detect issues caused by poor soldering or component installation.
Infrared Thermography: Using infrared thermal imaging, we detect abnormal temperature distributions on the PCB, identifying soldering issues, circuit shorts, or overheating problems.
Automated Optical Inspection (AOI): Our automated equipment conducts thorough optical inspections, identifying soldering defects, component misalignments, and other issues with high precision.
In-Circuit Testing (ICT): Specialized testing equipment checks for electrical connectivity issues such as open circuits, short circuits, and resistance values, ensuring all connections are sound.
Functional Circuit Testing (FCT): We simulate real-world conditions to test the functional performance of the PCB post-assembly, ensuring it operates as expected.
By integrating these rigorous inspection methods into our manufacturing process, we guarantee the quality and reliability of our PCBs, meeting and exceeding industry standards. Whether you need small or large volume production, trust CEN PCBA for your electronic manufacturing needs. Contact us today to learn more!
