Introduction Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder… Read More »PCB Assembly Process Reflow Soldering
Solder paste printing is a key part in the SMT (Surface Mount Technology) process. The aim of this process is to accurately deposit the correct amount onto each of the pads to be soldered. This is achieved by screen-printing the… Read More »Solder paste printing in smt process
Brief Introduction about solder Paste in PCB Assembly Solder paste is typically used in a stencil-printing process by a solder paste printer, in which paste is deposited over a stainless steel or polyester mask to create the desired pattern on a printed circuit board. The paste may be… Read More »Solder Paste
Introduction What is 3D SPI in PCBA process? 3D SPI is Solder Paste Inspection in the PCB Assembly Process. As PCBA manufacturing process has become more complex with the increased introduction of smaller components. It’s been proven that during the… Read More »3D SPI in PCBA process
