STM32 has always been one of the focal points of attention for everyone. Hence, catering to your interests, I’m here to present an introduction to STM32. Check out the details below: I. STM32 The STM32 Connectivity series microcontrollers introduce a… Read More »STM32 Series: Enhanced Connectivity and FSMC Extension
With continuous technological advancements, Energy Storage PCBA finds widespread application in the energy storage field. These PCB assemblies play a crucial role in power systems, electric vehicles, solar cells, and various energy equipment. This article delves into the process characteristics of Energy Storage PCBA mounting and… Read More »What are the Characteristics for Energy Storage PCBA
The FPC, also known as the Flexible Printed Circuit Board, has a significantly different assembly and soldering process compared to rigid circuit boards. This is because the FPC’s flexibility and softness require special carrier boards for fixation and transmission. Without these, basic SMT processes like printing,… Read More »The Differences assembly Assembly Procedures of FPC vs Rigid PCB
When it comes to Surface Mount Technology (SMT) production, cases of welding failure caused by missing drill files are not uncommon. Solder paste printing in SMT welding is a crucial and rather complex process, with data suggesting that 60-70% of… Read More »Addressing Welding Failures in SMT Production Due to Missing Drill Files
As a comprehensive PCBA manufacturer, we aim to shed light on the significance and nuances of OSP (Organic Solderability Preservatives) surface finishing in PCB manufacturing. OSP, or Organic Solderability Preservatives, also known as Copper Protective Agent, is a widely-used surface… Read More »OSP Surface Finishing in PCB Manufacturing: What You Need to Know
During the Surface Mount Technology (SMT) manufacturing process, Printed Circuit Boards (PCBs) can experience warping, leading to various defects such as component misalignment and tombstoning. In this article, we will discuss effective methods employed by Shenzhen PCBA manufacturers to prevent… Read More »How to Prevent PCB Warping in PCBA Manufacturing during SMT Process
PCBAs are intricate assemblies with numerous components and solder connections. To ensure their flawless performance, In-Circuit Testing (ICT) is vital. ICT assesses individual components and electronic characteristics for imperfections. It’s a longstanding, dependable testing method in electronics. PCBA ICT Testing… Read More »The Importance of In-Circuit Testing (ICT) in PCBAs
Solder paste printing is undeniably one of the most formidable challenges in quality assurance within the realm of electronic manufacturing. This challenge escalates as technological advancements usher in a fusion of large modules and diminutive chip components on densely populated… Read More »Mastering the Solder Paste Printing Process in Electronic Manufacturing
Are you looking for a reliable partner to handle your box build projects? Look no further than CEN, the leading provider of comprehensive solutions for integrating electronics into mechanical enclosures. CEN PCB Capabilities At CEN, we have over 15 years… Read More »CEN: Your Trusted Partner for Box Build OEM Services
Reflow soldering is the main method for attaching surface mount components to Printed Circuit Boards (PCBs). The process involves placing components on the board over paste deposits during the pick-and-place operation. Then, the reflow soldering process creates a reliable electrical… Read More »Reflow Soldering in SMT Process
